Vacuum evaporation coating, sputtering coating, ion coating

Vacuum evaporation coating, sputtering coating, ion coating

Vacuum coating mainly includes vacuum evaporation, sputtering and ion coating 

which are all used to deposit various metal and non-metallic films on the surface of plastic parts 

by distillation or sputtering under vacuum condition. 

Very thin surface coatings can be obtained by this way, meanwhile, it has the advantages of fast adhesion and normally it’s can be applied to the functional coatings 

for the high grade product.  

Vacuum evaporation is a method of heating metal to melt under high vacuum, 

evaporate and form metal film on the surface of the sample after cooling. 

The coating thickness is 0.8-1.2um. 

Tiny concave and convex parts of the forming surface are filled to obtain 

the surface like the mirror surface. Whether vacuum evaporation is 

in order to obtain mirror effect or vacuum evaporation for steel grab with 

low density connection, both of them must be treated with bottom painting.    

Sputtering coating usually refers to the magnetron sputtering coating, which belongs 

to high speed low temperature sputtering coating. 

This process requires a vacuum of about 1x10-3Torr, 

that is 1.3x10-3Pa vacuum filled with inert gas argon (Ar) and add high voltage DC 

between the plastic substrate (anode) and the metal target (cathode).

Because the electrons which caused by glow discharge excite the inert gas 

and produce ion, the ion blow out the atoms of metal target and deposit then 

on the plastic surface, General metal coating is mostly DC sputtering, 

while non-conductive materials use RFAC sputtering coating.

Ion plating is a method of partially ionization of gas or evaporated substance 

by gas discharge under vacuum condition and deposition of evaporated substance 

or its reactants on substrate under the bombardment of gas ion or evaporated substance ion. 

These include magnetron sputtering ion plating, reactive ion plating, 

hollow cathode discharge ion plating (hollow cathode evaporation), 

multi-arc ion plating (cathode arc ion plating) and etc.